4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Terrance A. Krinke

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Laminated multilayer substrates

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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Laminated multilayer substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Plated compliant lead

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Plated compliant lead

Metal fusion bonding – Process – Plural joints
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Profile ID: LFUS-PAI-P-60086

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