Plated compliant lead

Details Plated compliant lead Plated compliant lead

1993-10-01

1994-05-31

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361764, 361776, 361783, 361813, 174260, 257692, H01R 900

Patent

active

053174798

ABSTRACT:
A curved lead provides a mechanical and electrical connection between a board contact on a circuit board and a chip contact associated with a circuit chip. The chip can be mounted to the circuit board, to a chip carrier or to a multiple-chip module. The curved lead is substantially entirely plated with solder and is formed of a single piece of conductive material. The curved lead has a first surface for connection to the chip contact and a second surface, generally parallel to the first surface, for connection to the board contact. The first and second surfaces are connected by at least one curved portion and are arranged to mount the circuit chip to the circuit board with the solder in a compliant, generally parallel arrangement substantially free of stress.

REFERENCES:
patent: 2438075 (1948-03-01), Smith
patent: 3864014 (1975-02-01), Lynch
patent: 4592617 (1986-06-01), Seidler
patent: 4673967 (1987-06-01), Hingorany
patent: 4677458 (1987-06-01), Morris
patent: 4705205 (1987-11-01), Allen et al.
patent: 4755146 (1988-07-01), Rishworth et al.
patent: 4788767 (1988-12-01), Desai et al.
patent: 4827611 (1989-05-01), Pai et al.

Affiliated with

Also associated with

Rating

Plated compliant lead does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plated compliant lead, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plated compliant lead will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1632367