Semiconductor package with mold lock vent

Details Semiconductor package with mold lock vent Semiconductor package with mold lock vent

2008-03-04

2010-06-08

Richards, N Drew (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S666000, C257S667000, C257S779000, C257SE23023, C257SE23031, C257SE23026, C257SE23021

Reexamination Certificate

active

07732937

ABSTRACT:
A semiconductor package including a leadframe having first and second major surfaces and a mold lock opening extending between the first and second major surfaces. The semiconductor package includes a semiconductor die coupled to the first major surface, and an encapsulating material formed about the semiconductor chip and a portion of the first major surface of the leadframe and filling all but a portion of the mold lock opening, the unfilled portion of the mold lock opening forming a vent extending from the second major surface to the first major surface, the vent providing a pathway for air to escape from between the second major surface and a surface to which the second major surface is to be attached.

REFERENCES:
patent: 4143456 (1979-03-01), Inoue
patent: 5203076 (1993-04-01), Banerji et al.
patent: 5218234 (1993-06-01), Thompson et al.
patent: 5612576 (1997-03-01), Wilson et al.
patent: 5998243 (1999-12-01), Odashima et al.
patent: 6038136 (2000-03-01), Weber
patent: 6081997 (2000-07-01), Chia et al.
patent: 6250606 (2001-06-01), Juso et al.
patent: 7288843 (2007-10-01), Prior et al.
patent: 2008/0157330 (2008-07-01), Kroehnert et al.
patent: 0143518 (2001-06-01), None

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