4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Configuration or pattern of bonds

Te Tsung Chao

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Ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
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Method for positioning bond pads in a semiconductor die

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
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Method of automatically identifying and skipping defective...

Semiconductor device manufacturing: process – Including control responsive to sensed condition – Optical characteristic sensed
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Profile ID: LFUS-PAI-P-2101594

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