4. Alloys or metallic compositions
  5. Palladium base

Takeshi Kujiraoka

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Clad bonding wire for semiconductor device

Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils
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Gold wire for the bonding of a semiconductor device

Alloys or metallic compositions – Gold base – Palladium containing
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High purity gold bonding wire for semiconductor device

Alloys or metallic compositions – Gold base
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Palladium bonding wire for semiconductor device

Alloys or metallic compositions – Palladium base
Patent

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Profile ID: LFUS-PAI-P-929139

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