High purity gold bonding wire for semiconductor device

Details High purity gold bonding wire for semiconductor device High purity gold bonding wire for semiconductor device

1991-05-31

1994-03-29

Dean, R.

Alloys or metallic compositions

Gold base

420508, 420509, 420510, 420511, 420512, 228904, C22C 502

Patent

active

052982190

ABSTRACT:
Bonding wire for a semiconductor device contains high purity Au or Au alloy as a base metal and 25-10000 atppm of low boiling point element I having a boiling point lower than a melting point of the base metal and soluble in Au, or contains high purity Au or Au alloy as a base metal and 5-500 atppm of low boiling point element II having a boiling point lower than a melting point of the base metal and insoluble in Au, or contains high purity Au or Au alloy as a base metal and 5-10000 atppm of a mixture of low boiling point element I having a boiling point lower than a melting point of the base metal and soluble in Au and low boiling point element II having a boiling point lower than the melting point of the base metal and insoluble in Au under the condition of (content of the low boiling point element I)/25+(content of the low boiling point element II)/5.gtoreq.1.gtoreq.(content of the low boiling point element I)/10000+(content of the low boiling point element II)/500. The low boiling point elements I and II may be replaced by low boiling point element III soluble in Pd and low boiling point element IV insoluble in Pd, respectively.

REFERENCES:
Bruce L. Gehman, "Gold Wire for Automated Bonding", Solid State Technology; Mar. 1980, pp. 84-91.

Affiliated with

Also associated with

Rating

High purity gold bonding wire for semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High purity gold bonding wire for semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High purity gold bonding wire for semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-789671