Gold wire for the bonding of a semiconductor device

Details Gold wire for the bonding of a semiconductor device Gold wire for the bonding of a semiconductor device

1989-10-31

1990-07-03

McDowell, Robert

Alloys or metallic compositions

Gold base

Palladium containing

420507, 420508, 420510, 420511, 420512, 428606, C22C 502

Patent

active

049389238

ABSTRACT:
The gold wire used for the wire bonding of a semiconductor device comprises at least three kinds of elements selected from rare earth elements such as La, Ce and Pr: Be, Ca, Mg, Ag, Fe: and platinum group elements; and the balance of Au at high purity.

REFERENCES:
patent: 3272625 (1966-09-01), Brenner
patent: 4080485 (1978-03-01), Bonkohara
patent: 4330329 (1982-05-01), Hayashi et al.
patent: 4752442 (1988-06-01), Asada et al.
patent: 4775512 (1988-10-01), Fukui et al.

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