4. Electricity: conductors and insulators
  5. Feedthrough or bushing
  6. Compression

Takehisa Tsujimura

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Ceramic package type semiconductor device and method of assembli

Fishing – trapping – and vermin destroying
Patent

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Ceramic package type semiconductor device and method of assembli

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
Patent

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Multi-chip semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Multi-chip semiconductor device and method of producing the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Semiconductor device including leadless packages and a base plat

Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent

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Profile ID: LFUS-PAI-P-384255

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