Ceramic package type semiconductor device and method of assembli

Details Ceramic package type semiconductor device and method of assembli Ceramic package type semiconductor device and method of assembli

1991-05-10

1992-01-14

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437215, 437216, 437217, 437218, 357 74, 357 80, 361381, H01L 2160

Patent

active

050810677

ABSTRACT:
A ceramic package type semiconductor device comprising: a ceramic substrate having a wiring pattern layer formed on a top surface thereof; at least one semiconductor element mounted on the ceramic substrate with a top face thereof facing downward and electrically connected to the wiring patttern layer; a metal cap having at least one through-hole corresponding to an external size of the semiconductor element and an end portion thereof soldered to the top surface of the ceramic substrate, so that a top surface of the metal cap and a bottom surface of the semiconductor element fitting into the through-hole form a flat plane: and a heatsink member comprising a plate portion which is soldered to the flat plane of the metal cap and the semiconductor element to complete a hermetic sealing of the semiconductor element.

REFERENCES:
patent: 4023562 (1977-05-01), Hynecek et al.
patent: 4177480 (1979-12-01), Hintzmann et al.
patent: 4523371 (1985-06-01), Wakashima
patent: 4761518 (1988-08-01), Butt et al.
patent: 4769345 (1988-09-01), Butt et al.
patent: 4873615 (1989-10-01), Grabbe
patent: 4878108 (1989-10-01), Phelps, Jr. et al.
patent: 4908696 (1990-03-01), Ishihara et al.
patent: 4926242 (1990-05-01), Itoh et al.
patent: 4939570 (1990-07-01), Bickford et al.
patent: 4980753 (1990-12-01), Punaway et al.

Affiliated with

Also associated with

Rating

Ceramic package type semiconductor device and method of assembli does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ceramic package type semiconductor device and method of assembli, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ceramic package type semiconductor device and method of assembli will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-541351