4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Takahiko Takahashi

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IC wiring connecting method and apparatus

Coating apparatus – Gas or vapor deposition – With treating means
Patent

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IC wiring connecting method and apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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IC wiring connecting method and resulting article

Stock material or miscellaneous articles – All metal or with adjacent metals – Having aperture or cut
Patent

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IC wiring connecting method using focused energy beams

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Method for modifying wiring of semiconductor device

Fishing – trapping – and vermin destroying
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Profile ID: LFUS-PAI-P-430404

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