Coating apparatus – Gas or vapor deposition – With treating means
Patent
1994-05-06
1995-12-05
Breneman, R. Bruce
Coating apparatus
Gas or vapor deposition
With treating means
118719, 118723MP, 118726, 118723IR, C23C 1600
Patent
active
054725070
ABSTRACT:
An IC wiring connecting method for interconnecting conductive lines of the same wiring plane of an IC chip for correcting the wiring, for interconnecting conductive lines of different wiring lanes of a multilayer IC chip at the same position, or for connecting a conductive line of a lower wiring plane of a multilayer IC chip to a conductive line formed at a separate position on the same multilayer IC chip. The insulating film or films covering conductive lines to be interconnected are processed by an energy beam such as a concentrated ion beam to form holes so as to expose the respective parts of the conductive lines where the conductive lines are to be interconnected, then a metal is deposited over the surfaces of the holes and an area interconnecting the holes by irradiating the surfaces of the holes and the area by an energy beam or a concentrated ion beam in an atmosphere of a gaseous organic metal compound to form a conductive metal film electrically interconnecting the conductive lines. Also provided is an apparatus for carrying out the IC wiring connecting method, which comprises, as essential components, an ion beam material processing system, an insulating film forming system such as a laser induced CVD unit, a conductive film forming system, and an insulating film etching system.
Haraichi Satoshi
Hongo Mikio
Miyauchi Tateoki
Saito Keiya
Shimase Akira
Breneman R. Bruce
Chang Joni
Hitachi , Ltd.
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