Fishing – trapping – and vermin destroying
Patent
1990-05-23
1993-01-26
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437174, 437190, H01L 2126
Patent
active
051822318
ABSTRACT:
The wiring of a semiconductor device having a multilayer interconnection on a semiconductor substrate is modified. A plurality of fine holes are formed on an insulation film by the radiation of a converged energy beam to expose selected ones of the internal lines of the underlying wiring. A thin buffer film of Cr, Ti, TiN, or W is formed along a path where an additional connection line is to be deposited. The path extends along an upper surface of the insulating film at least in and between the said fine holes. The additional connection line is deposited on the buffer film by energy beam CVD, using Mo, W, or Al, to interconnect the exposed internal lines. The additional connection line is annealed by radiating an energy beam thereon to reduce its resistance. A further insulating film is deposited covering the additional connection line by energy beam CVD.
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Hongo Mikio
Kamimura Takashi
Mizukoshi Katsuro
Sano Shyuzo
Takahashi Takahiko
Fleck Linda J.
Hearn Brian E.
Hitachi , Ltd.
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