4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Takaharu Yonemoto

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Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Lead frame for lead on chip

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Lead frame for LOC having a regulating lead to prevent variation

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Method and apparatus for sticking a film to a lead frame

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Profile ID: LFUS-PAI-P-333952

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