Lead frame

Details Lead frame Lead frame

1997-06-12

2000-08-22

Potter, Roy

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257692, H01L 23495

Patent

active

061076759

ABSTRACT:
A lead frame for semiconductor device comprises first inner leads 21-2, 21-3 and 21-4 each having a region 22-2, 22-3, 22-4 on which a predetermined quantity of adhesive is applied, and second inner leads 21-1 and 21-5 each having a region 22-1, 22-5 which is wider than those of the first inner leads. The first inner leads 21-2, 21-3 and 21-4 have a width W.sub.1, while the second inner leads 21-1 and 21-5 have a width W.sub.2 which is wider than W1. The second inner leads 21-1 and 21-5 are arranged at the positions where one successive application of varnish-like adhesive to the inner leads begins and ends, respectively. The ratio of W.sub.1 to W.sub.2 is preferably 1 to 1.3 (i.e., W.sub.1 :W.sub.2 =1:1.3) or more. Even if an excessive quantity of varnish-like adhesive is applied to the beginning inner lead 21-1 or the ending inner lead 21-5, it is spread over the region 22-1 or 22-5, then adhesive layers having uniform thickness are formed.

REFERENCES:
patent: 5384487 (1995-01-01), Rostoker et al.
patent: 5455200 (1995-10-01), Bigler et al.
patent: 5872398 (1999-02-01), King et al.

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