Method and apparatus for sticking a film to a lead frame

Details Method and apparatus for sticking a film to a lead frame Method and apparatus for sticking a film to a lead frame

1996-04-23

2000-05-16

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156518, 1565831, 156264, 156265, 83690, 83 31, 83684, 83685, 83686, B32B 3100

Patent

active

060632283

ABSTRACT:
An apparatus for sticking a film to a lead frame has a punch moving up and down for punching a film, a die for placing the film to be punched, and a heating plate for heating a lead frame. A punched film with a predetermined shape is applied on the lead frame and thermally compressed and adhesively attached on a lead portion of the lead frame. The die is additionally provided with a buffer layer on the top plane of the die for relaxing compressing stress but increasing tensile stress put to the film at the punching step so that a punched film is prevented from producing cracks on the cutting end thereof.

REFERENCES:
patent: 2568152 (1951-09-01), Hermann
patent: 3355340 (1967-11-01), Calvert et al.
patent: 5458717 (1995-10-01), Kurita

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