4. Article dispensing
  5. Automatic control
  6. Of supply to dispenser

Takaharu Mae

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Apparatus and method for forming bump

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
Reexamination Certificate

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Apparatus and method for forming bump

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
Reexamination Certificate

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Apparatus and method for mounting electronic components

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Bump bonding apparatus and method

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Bump bonding apparatus and method

Metal fusion bonding – Including means to apply flux or filler to work or applicator – Solid flux or solid filler
Reexamination Certificate

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Profile ID: LFUS-PAI-P-823301

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