Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
Reexamination Certificate
2008-04-01
2008-04-01
Johnson, Jonathan (Department: 1793)
Metal fusion bonding
With control means responsive to sensed condition
Work-responsive
C228S234100, C438S613000
Reexamination Certificate
active
07350684
ABSTRACT:
A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).
REFERENCES:
patent: 4909429 (1990-03-01), Ankrom et al.
patent: 5259545 (1993-11-01), Huang
patent: 5607609 (1997-03-01), Sakuyama et al.
patent: 5842627 (1998-12-01), Takanashi et al.
patent: 6053398 (2000-04-01), Iizuka et al.
patent: 6059170 (2000-05-01), Jimarez et al.
patent: 6181015 (2001-01-01), Gotoh et al.
patent: 6206265 (2001-03-01), Yamaoka
patent: 6600137 (2003-07-01), Nonomura et al.
patent: 6787391 (2004-09-01), Imanishi et al.
patent: 7014092 (2006-03-01), Narita et al.
patent: 2002/0092595 (2002-07-01), Fogal et al.
patent: 2002/0106603 (2002-08-01), L. Foong et al.
patent: 2003/0137080 (2003-07-01), Bouras et al.
Fukumoto Kenji
Higashi Kazushi
Ikeya Masahiko
Imanishi Makoto
Kanayama Shinji
Aboagye Michael
Johnson Jonathan
Matsushita Electric - Industrial Co., Ltd.
Wenderoth , Lind & Ponack, L.L.P.
LandOfFree
Apparatus and method for forming bump does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for forming bump, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for forming bump will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2769120