Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2007-11-20
2007-11-20
Kerns, Kevin P. (Department: 1725)
Metal fusion bonding
Process
Plural joints
C228S006200, C228S102000, C228S008000, C228S044300
Reexamination Certificate
active
10324001
ABSTRACT:
After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.
REFERENCES:
patent: 4236306 (1980-12-01), Hug et al.
patent: 4295596 (1981-10-01), Doten et al.
patent: 4752025 (1988-06-01), Stach et al.
patent: 4875614 (1989-10-01), Cipolla et al.
patent: 5065933 (1991-11-01), Basavanhally
patent: 5145099 (1992-09-01), Wood et al.
patent: 5309545 (1994-05-01), Spigarelli et al.
patent: 5667129 (1997-09-01), Morita et al.
patent: 5786271 (1998-07-01), Ohida et al.
patent: 5788143 (1998-08-01), Boyd et al.
patent: 5799543 (1998-09-01), Nagai et al.
patent: 5803339 (1998-09-01), Hoshiba et al.
patent: 5878942 (1999-03-01), Kodama et al.
patent: 5971250 (1999-10-01), Safabakhsh et al.
patent: 6122823 (2000-09-01), Kira et al.
patent: 6131795 (2000-10-01), Sato
patent: 6463359 (2002-10-01), Fischer
patent: 6537400 (2003-03-01), Fogal et al.
patent: 6544377 (2003-04-01), Minamitani et al.
patent: 6550669 (2003-04-01), Walz et al.
patent: 6605500 (2003-08-01), Hudson et al.
patent: 6640423 (2003-11-01), Johnson et al.
patent: 6821813 (2004-11-01), Su
patent: 2003/0009876 (2003-01-01), Yamauchi
patent: 8-204327 (1996-08-01), None
patent: 9-129687 (1997-05-01), None
patent: 2947220 (1999-07-01), None
patent: 11-330791 (1999-11-01), None
Akita Makoto
Hirata Shuichi
Mae Takaharu
Minamitani Shozo
Onobori Shunji
Kerns Kevin P.
Matsushita Electric - Industrial Co., Ltd.
Wenderoth , Lind & Ponack, L.L.P.
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