Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
Reexamination Certificate
2008-04-01
2008-04-01
Johnson, Jonathan (Department: 1793)
Metal fusion bonding
With control means responsive to sensed condition
Work-responsive
C228S234100, C438S613000
Reexamination Certificate
active
11114084
ABSTRACT:
A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).
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Fukumoto Kenji
Higashi Kazushi
Ikeya Masahiko
Imanishi Makoto
Kanayama Shinji
Aboagye Michael
Johnson Jonathan
Wenderoth , Lind & Ponack, L.L.P.
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