4. Electrical transmission or interconnection systems
  5. Nonlinear reactor systems
  6. Parametrons

Tae-sung Jeong

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Method of manufacturing a semiconductor package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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MOS transistor temperature detecting circuit

Electrical transmission or interconnection systems – Personnel safety or limit control features – Interlock
Patent

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Semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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TTL to CMOS input buffer circuit

Electrical transmission or interconnection systems – Nonlinear reactor systems – Parametrons
Patent

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Profile ID: LFUS-PAI-P-1017598

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