Method of manufacturing a semiconductor package

Details Method of manufacturing a semiconductor package Method of manufacturing a semiconductor package

2011-01-25

2011-01-25

Tran, Thien F (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S777000, C257S778000, C257SE21511

Reexamination Certificate

active

07875497

ABSTRACT:
A method of manufacturing a semiconductor package which includes mounting a first chip on a first substrate by a flip chip method, the first substrate having a pre-designed pattern formed thereon; forming a cavity by etching a center portion of a metal oxide layer; mounting a second chip inside the cavity; forming at least one via such that the via penetrates an edge of the metal oxide layer; placing the metal oxide layer on the first substrate such that the second chip and the first chip face each other; and placing a second substrate on the metal oxide layer, the second substrate having a third chip mounted thereon.

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