4. Stock material or miscellaneous articles
  5. Web or sheet containing structurally defined element or...
  6. Physical dimension specified

Tae-Keun Lee

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Matte biaxially oriented polypropylene film with improved...

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Physical dimension specified
Reexamination Certificate

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Standoff height improvement for bumping technology using...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Standoff height improvement for bumping technology using...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2787489

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