Metal fusion bonding
Process
Preplacing solid filler
Inventor
active
Boat transport for suporting semiconductor device assemblies
Centering lid seal clip apparatus
Fixture for attaching multiple lids to multi-chip module (MCM) i
High pressure lid seal clip apparatus
Integrated circuit packaging apparatus and method
No associations
LandOfFree
Sutee Vongfuangfoo does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Sutee Vongfuangfoo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sutee Vongfuangfoo will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-348926