Boat transport for suporting semiconductor device assemblies

Details Boat transport for suporting semiconductor device assemblies Boat transport for suporting semiconductor device assemblies

1992-12-24

1995-02-28

Chin-Shue, Alvin C.

Supports: racks

Special article

Electrically powered

206328, B65D 8542

Patent

active

053929322

ABSTRACT:
A boat transport is fabricated to receive either pins-down or pins-up type semiconductor device assemblies, without damaging the pins, and to position the body of the semiconductor device assembly for subsequent packaging processes. The boat transport includes a planar platform for supporting a peripheral portion of the package body. A single large cutout through the platform receives all of the pins of the semiconductor device assembly. Guides which extend downward from the platform along each side (edge) of the cutout prevent lateral and rotational movement of a pins-down package. Other guides, which ascend upward from the platform along each side (edge) of the cut out, prevent pins-up packages from lateral and rotational movement. Additional cutouts through the platform accommodate chip capacitors.

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patent: 5064063 (1991-11-01), Manca et al.
patent: 5080228 (1992-01-01), Marston, III et al.
patent: 5103976 (1992-04-01), Murphy
patent: 5119934 (1992-06-01), Karasawa et al.

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