High pressure lid seal clip apparatus

Details High pressure lid seal clip apparatus High pressure lid seal clip apparatus

1995-10-04

1998-02-10

Sells, James

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With handle or handgrip

156300, 156580, 269238, 269903, B25B 2702

Patent

active

057164932

ABSTRACT:
A lid is sealed to an integrated circuit package using a spring biased pressure foot that is structurally carried by a secondary loading jig to impose sealant curing load on the lid. The secondary jig attaches to the fabrication boat at a position indexed to apply optimal assembly force at the package center normal of the package lid plane.

REFERENCES:
patent: 3775644 (1973-11-01), Cotner et al.
patent: 4669416 (1987-06-01), Delgado et al.
patent: 4875966 (1989-10-01), Perko et al.
patent: 5106451 (1992-04-01), Kan et al.
patent: 5154339 (1992-10-01), Takeuchi et al.
patent: 5465470 (1995-11-01), Vongfuangfoo et al.
patent: 5501436 (1996-03-01), Miller

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