4. Metal fusion bonding
  5. Process
  6. Using high frequency vibratory energy

Susumu Okikawa

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Encapsulated semiconductor device with a metallic base plate

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Heat spreader semiconductor device with heat spreader and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Lead frame and semiconductor device using the same

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Method and apparatus of bonding insulated and coated wire

Electric heating – Metal heating – By arc
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Method for producing a heat spreader and semiconductor device wi

Metal working – Method of mechanical manufacture – Heat exchanger or boiler making
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Profile ID: LFUS-PAI-P-254287

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