Lead frame and semiconductor device using the same

Details Lead frame and semiconductor device using the same Lead frame and semiconductor device using the same

1988-02-09

1988-12-13

James, Andrew J.

357 72, H01L 2348

Patent

active

047914726

ABSTRACT:
A resin encapsulated type semiconductor device is manufactured by using a lead frame in which a stress relaxation portion is formed near the connection portion between the tab suspending the lead and the tab according to this invention, whereby stress concentration to the tab at the connection portion of the tab suspending lead can be prevented even when the tab as the pellet mounting portion is thermally expanded thereby preventing crackings from resulting in the semiconductor pellets.

REFERENCES:
patent: 4234666 (1980-11-01), Gursky
Integrated Mounting Techniques, Microelectronics Association 1/15/80.

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