Encapsulated semiconductor device with a metallic base plate

Details Encapsulated semiconductor device with a metallic base plate Encapsulated semiconductor device with a metallic base plate

1979-11-21

1982-04-20

James, Andrew J.

357 72, 357 65, 357 68, H01L 2302, H01L 2328, H01L 2348

Patent

active

043262155

ABSTRACT:
A semiconductor device comprising a metallic base plate whose side surfaces are formed with cut-away portions having circular arc-shaped parts, a semiconductor element which is connected to the surface of the metallic base plate, and a resin which lies in contact with the cut-away portions and which seals the semiconductor element.

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patent: 3786317 (1974-01-01), Thierfelder
patent: 3836825 (1974-09-01), Hall et al.
patent: 4048670 (1977-09-01), Eysermans
patent: 4107727 (1978-08-01), Ikezawa et al.
patent: 4125740 (1978-11-01), Paletto
patent: 4132856 (1979-01-01), Hutchison

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