4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Susan Swindlehurst

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Apparatus incorporating small-feature-size and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Apparatuses and methods for high speed bonding

Communications: electrical – Condition responsive indicating system – Specific condition
Reexamination Certificate

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Assembly comprising functional block deposited therein

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method and structure for uniform height solder bumps on a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2026875

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