Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2007-05-08
2007-05-08
Graybill, David E. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S597000, C438S652000, C438S654000, C438S665000
Reexamination Certificate
active
10769572
ABSTRACT:
An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.
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Craig Gordon S. W.
Drzaic Paul S.
Eisenhardt Randolph W.
Gengel Glenn
Hadley Mark A.
Alien Technology Corporation
Blakely & Sokoloff, Taylor & Zafman
Graybill David E.
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