Apparatuses and methods for high speed bonding

Communications: electrical – Condition responsive indicating system – Specific condition

Reexamination Certificate

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C340S572100, C340S572400, C340S572800, C257S673000, C257S674000, C257S411000, C235S375000, C235S382000, C235S492000

Reexamination Certificate

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07576656

ABSTRACT:
Apparatuses and methods for high speed bonding for an RFID device are provided. A first substrate includes an antenna and is coupled to a strap assembly by an adhesive material. The adhesive material is substantially inert thermally for a predetermined temperature range, or it otherwise lacks a heat flow variation greater than 0.05 W/g for the predetermined temperature range. Such an adhesive material provides a reliable bond. In a specific embodiment, the predetermined temperature range is about 30° Celsius to about 85° Celsius. In an alternative embodiment, the adhesive material can be exposed to water or steam to reduce its heat flow variation to less than 0.05 W/g for the temperature range.

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patent: 5682143 (1997-10-01), Brady et al.
patent: 6606247 (2003-08-01), Credelle et al.
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patent: 7214569 (2007-05-01), Swindlehurst et al.
patent: 2004/0183182 (2004-09-01), Swindlehurst et al.
patent: 2004/0217431 (2004-11-01), Shimada
patent: WO 03/063211 (2003-07-01), None

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