4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Susan J. Swindlehurst

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Method and structure for uniform height solder bumps on a semico

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Redistribution layer and under bump material structure for conve

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent

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Solder retention ring for improved solder bump formation

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Profile ID: LFUS-PAI-P-763210

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