Metal fusion bonding – Process – Preplacing solid filler
Patent
1999-01-22
2000-07-11
Mills, Gregory
Metal fusion bonding
Process
Preplacing solid filler
228215, 2282481, 438612, 438613, B23K 3514, B23K 3102, H01L 21441
Patent
active
060859687
ABSTRACT:
A method of forming solder bumps on a wafer. The wafer includes at least one substrate, a plurality of solder-wettable pads and a solder wettable retention ring about the periphery of the wafer. The method of forming solder bumps includes forming a non-solder-wettable mask on the wafer which includes a plurality of apertures which align with the solder-wettable pads, and the solder wettable retention ring surrounds the mask. The mask and wafer are positioned within an aperture of a stencil so that the solder wettable retention ring aligns with a gap between the periphery edge of the mask and an inside edge of the aperture of the stencil. Solder paste is applied to the mask so that the solder paste fills the apertures of the mask and the gap. The solder paste is reflowed forming solder bumps on the pads and a solder ring on the solder wettable retention ring. The mask is removed after formation of the solder bumps.
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Leibovitz Jacques
Swindlehurst Susan J.
Vander Plas Hubert A.
Hewlett--Packard Company
Mills Gregory
Short Brian R.
Stoner Kiley
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