Method and structure for uniform height solder bumps on a semico

Details Method and structure for uniform height solder bumps on a semico Method and structure for uniform height solder bumps on a semico

1999-10-08

2000-11-14

Quach, T. N.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438614, 438678, 438926, H01L 2144

Patent

active

06146984&

ABSTRACT:
Uniform height solder bumps are created on a semiconductor wafer by exposing a dummy pattern of under bump metal for solder plating. The dummy pattern of exposed under bump metal follows the outer edge outline of a pattern of die that exists on the semiconductor wafer. The dummy pattern of under bump metal is exposed by removing a portion of a layer of photoresist that is deposited over the under bump metal. The dummy pattern of under bump metal is exposed on the wafer at the same time that under bump metal above the contact pads is exposed. Solder material is then plated onto the exposed under bump metal that exists above the contact pads and in the dummy pattern. The dummy pattern of exposed under bump metal around the outer edge of the die pattern causes current crowding to occur primarily at the dummy pattern of exposed under bump metal instead of at the contact pads that are on die at the outer edge of the die pattern. Because current crowding occurs primarily at the dummy pattern of exposed under bump metal instead of at the exposed under bump metal above the contact pads of the outer edge die, the plating current density across the die pattern is more uniform, thereby producing solder bumps having a more uniform height.

REFERENCES:
patent: 5391285 (1995-02-01), Lytle et al.
patent: 5508229 (1996-04-01), Baker
patent: 5670034 (1997-09-01), Lowery
patent: 5763057 (1998-06-01), Sawada et al.
patent: 5767010 (1998-06-01), Mis et al.
patent: 5903058 (1999-05-01), Akram
patent: 5981314 (1999-11-01), Glenn et al.
patent: 6077765 (2000-06-01), Naya
patent: 6080650 (2000-06-01), Edwards
patent: 6085968 (2000-07-01), Swindlehurst et al.

Affiliated with

Also associated with

Rating

Method and structure for uniform height solder bumps on a semico does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and structure for uniform height solder bumps on a semico, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and structure for uniform height solder bumps on a semico will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2064831