4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Sung Uk Yang

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Integrated circuit package system with encapsulation lock

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Integrated circuit package system with encapsulation lock...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Waferscale package system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2306197

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