Integrated circuit package system with encapsulation lock

Details Integrated circuit package system with encapsulation lock Integrated circuit package system with encapsulation lock

2006-09-15

2011-11-29

Lee, Eugene (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S666000, C257S670000, C257SE23039, C257SE23043, C257SE23046, C438S111000

Reexamination Certificate

active

08067271

ABSTRACT:
An integrated circuit package system is provided including forming an external interconnect and a tie bar, forming a lead tip and a lead body of the external interconnect, forming a hole in the external interconnect, forming a slot in the tie bar, connecting an integrated circuit die and the external interconnect, and molding the external interconnect and the tie bar with the slot and the hole filled.

REFERENCES:
patent: 4862246 (1989-08-01), Masuda et al.
patent: 5623163 (1997-04-01), Izumi
patent: 5753969 (1998-05-01), Suzuya et al.
patent: 5898216 (1999-04-01), Steffen
patent: 5973388 (1999-10-01), Chew et al.
patent: 6127206 (2000-10-01), Nakamichi
patent: 6166430 (2000-12-01), Yamaguchi
patent: 6197615 (2001-03-01), Song et al.
patent: 6448633 (2002-09-01), Yee et al.
patent: 6483178 (2002-11-01), Chuang
patent: 6501161 (2002-12-01), Lee
patent: 6639306 (2003-10-01), Huang
patent: 6661083 (2003-12-01), Lee et al.
patent: 6812552 (2004-11-01), Islam et al.
patent: 6815833 (2004-11-01), Lee et al.
patent: 7042071 (2006-05-01), Minamio et al.
patent: 7060535 (2006-06-01), Sirinorakul et al.
patent: 7060536 (2006-06-01), Punzalan et al.
patent: 7115978 (2006-10-01), Sun et al.
patent: 7221045 (2007-05-01), Park et al.
patent: 7361531 (2008-04-01), Sharma et al.
patent: 2002/0079561 (2002-06-01), Yasunaga et al.
patent: 2003/0201520 (2003-10-01), Knapp et al.
patent: 2004/0046240 (2004-03-01), Hasebe
patent: 2004/0084757 (2004-05-01), Seo
patent: 2004/0175864 (2004-09-01), Mahle
patent: 2004/0227217 (2004-11-01), Jang
patent: 2004/0262781 (2004-12-01), Germain et al.
patent: 2005/0051876 (2005-03-01), Manalac et al.
patent: 2005/0242417 (2005-11-01), Youn et al.
patent: 2005/0258521 (2005-11-01), Park et al.
patent: 2007/0170559 (2007-07-01), Camacho et al.
patent: 2008/0067639 (2008-03-01), Do et al.
patent: 2008/0067698 (2008-03-01), Do et al.
K. Gilleo, Area Array Processes, McGraw Hill, 2004, p. 99.
K. Gilleo, Area Array Processes, McGraw Hill, 2004, p. 99.

Affiliated with

Also associated with

Rating

Integrated circuit package system with encapsulation lock does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package system with encapsulation lock, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package system with encapsulation lock will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4293944