Integrated circuit package system with encapsulation lock...

Details Integrated circuit package system with encapsulation lock... Integrated circuit package system with encapsulation lock...

2011-04-05

2011-04-05

Lee, Eugene (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S670000, C257SE23031, C257SE23032, C257SE21502, C438S124000

Reexamination Certificate

active

07919838

ABSTRACT:
A method of manufacture of an integrated circuit package system includes forming a paddle having a paddle top surface, the paddle top surface having a depression provided therein, forming an external interconnect having a lead tip and a lead body with the lead body having a first recess segment along a length-wise dimension of the lead body, connecting a device over the paddle top surface and the external interconnect, and filling a substantially electrically nonconductive material in the depression.

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