4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Sundar Kamath

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Isolated flip chip of BGA to minimize interconnect stress...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Isolated flip chip or BGA to minimize interconnect stress...

Metal fusion bonding – Process – Bonding nonmetals with metallic filler
Reexamination Certificate

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Stress resistant land grid array (LGA) module and method of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Wiring substrate with thermal insert

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2133331

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