4. Compositions: coating or plastic
  5. Coating or plastic compositions
  6. Corrosion inhibiting coating composition

Sumitomo Metal (SMI) Electronics Devices Inc.

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Chip package and method for manufacturing the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Chip package and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Chip package and method for manufacturing the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Conductive paste containing 2-tetradecanol and ceramic circuit s

Compositions – Electrically conductive or emissive compositions – Free metal containing
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Connected construction of a high-frequency package and a...

Wave transmission lines and networks – Long line elements and components – Strip type
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Profile ID: LFUS-PAI-P-551956

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