Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent
1996-03-06
1998-03-03
Lieberman, Paul
Compositions
Electrically conductive or emissive compositions
Free metal containing
252518, 252519, 106 113, 106 114, H01B 120, H01B 122
Patent
active
057230730
ABSTRACT:
A conductive paste for filling through holes for the interlayer electrical connection in a low-temperature firable ceramic circuit substrate to be fired at 800.degree. to 1,000.degree. C., which comprises a) 100 parts by weight of flaky and/or spherical silver-based powder particles; b) 0.1 to 2.0 parts by weight of b.sub.1) Sb.sub.2 O.sub.3 or a substance which is converted into Sb.sub.2 O.sub.3 by the firing and the amount of which is given in terms of Sb.sub.2 O.sub.3 and/or b.sub.2) Rh powder; and c) at least 3 parts by weight of 2-tetradecanol. The conductive paste has excellent printing properties and homogeneity because the viscosity change thereof is only small when it is printed into through holes of a ceramic circuit substrate and the crack formation after the firing is slight. Thus, the conductive paste is effective for efficient production of a ceramic circuit substrate of a high density wiring. The conductive paste may contain at least one organic resin selected from the group consisting of ethylcellulose, hydroxyethylcellulose and an acrylic resin.
REFERENCES:
patent: 4636332 (1987-01-01), Craig et al.
patent: 5395876 (1995-03-01), Frentzel et al.
Fukuta Junzo
Nakai Toshihiro
Kopec Mark
Lieberman Paul
Sumitomo Metal (SMI) Electronics Devices Inc.
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