Plastic article or earthenware shaping or treating: apparatus
Shaping surface including means to release or remove product...
By movable ejector means entering mold cavity
Inventor
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Device for resin sealing semiconductor devices
Device for resin sealing semiconductor devices
Long size lead frame for semiconductor elements
Method for molding a semiconductor package on a continuous leadf
Method of resin sealing semiconductor devices
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Profile ID: LFUS-PAI-P-98041