Method for molding a semiconductor package on a continuous leadf

Details Method for molding a semiconductor package on a continuous leadf Method for molding a semiconductor package on a continuous leadf

1992-04-30

1994-08-09

Chaudhuri, Olik

Metal working

Barrier layer or semiconductor device making

437207, 437214, 437220, 26427217, 425122, 4254519, H01L 2128, H01L 2160, B28B 700, B29C 4322

Patent

active

053362721

ABSTRACT:
A method and apparatus for sealing a semiconductor wherein an upper seal block of a cope and a lower seal block of a drag are provided with sealants for nipping a portion of a long size lead frame, so that the airtightness of a cavity enclosed with the cope and drag can be completely kept. The long size lead frame may have a continuing part extending from one of two side members to the other, provided between adjacent lead patterns to be pressed by the sealants, so that the airtightness of the cavity can be further completely kept.

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patent: 4680617 (1987-07-01), Ross
patent: 4816426 (1989-03-01), Bridges et al.
patent: 4942455 (1990-07-01), Shinohara

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