Device for resin sealing semiconductor devices

Details Device for resin sealing semiconductor devices Device for resin sealing semiconductor devices

1988-07-15

1990-04-10

Woo, Jay H.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Female mold type means

100 46, 100258R, 100258A, 425123, 425125, 425127, 425588, B29C 4516

Patent

active

049156080

ABSTRACT:
A device for resin sealing semiconductor devices includes a pair of chase blocks having cavities for holding semiconductor devices, a press machine for pressing the chase blocks against each other through a pair of press surfaces, a plurality of support members for holding the chase blocks over the respective press surfaces of the press machine and undergoing elastic compressive deformation during the press operation of the press machine, and a plastic injector for injecting plastic into the cavities in the chase blocks.

REFERENCES:
patent: 4735563 (1988-04-01), Tanaka et al.
patent: 4779835 (1988-10-01), Fukushima et al.
American College Dictionary, Barnhart, 1970, p. 459.

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