Method of resin sealing semiconductor devices

Details Method of resin sealing semiconductor devices Method of resin sealing semiconductor devices

1989-12-08

1991-10-22

Silbaugh, Jan H.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

26427217, B29C 4514

Patent

active

050593790

ABSTRACT:
A method of resin sealing semiconductor devices wherein semiconductor devices, such as semiconductor chips, are placed in cavities provided in a pair of chase blocks which are clamped by a press machine through support members capable of elastic compressive deformation. Plastic is then injected into the cavities of the chase blocks to resin seal the semiconductor devices.

REFERENCES:
patent: 4555086 (1985-11-01), Kiyotomo
patent: 4615857 (1986-10-01), Baird
patent: 4735563 (1988-04-01), Tanaka et al.
patent: 4779835 (1988-10-01), Fukushima et al.

Affiliated with

Also associated with

Rating

Method of resin sealing semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of resin sealing semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of resin sealing semiconductor devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-106891