4. Stock material or miscellaneous articles
  5. All metal or with adjacent metals
  6. Composite; i.e., plural, adjacent, spatially distinct metal...

Sudipta K. Ray

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Apparatus and method for repairing electronic packages

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Baseplate for chip burn-in and/of testing, and method thereof

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Chip carrier with embedded engineering change lines with severab

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent

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Dielectric interposer for chip to substrate soldering

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Dielectric interposer for chip to substrate soldering

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-126879

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