Chip carrier with embedded engineering change lines with severab

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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361409, 361414, 361416, H05K 118

Patent

active

044893647

ABSTRACT:
A chip carrying module includes a number of engineering change lines buried below the surface of the module. The engineering change lines are interrupted periodically to provide a set of vias extending up to the upper surface of the module between each set of chips where the vias are connected by dumbbell-shaped pads including a narrow link which permits laser deletion or the like. In addition, the dumbbell-shaped pads are located adjacent to the fan-out pads for the chips. Thus, the fan-out pads can be connected to the dumbbell-shaped pads by means of fly-wires. In addition, individual engineering change lines can be connected together to reach every region of the module by connecting a fly-wire from one dumbbell-shaped pad to another. In addition, by deleting the links at such dumbbell-shaped pads, the engineering change connections are limited to the particular path required.

REFERENCES:
patent: 3564115 (1971-02-01), Gribble
patent: 3777221 (1973-12-01), Tatsuko et al.
patent: 3803483 (1974-04-01), Mcmahon
patent: 3923359 (1975-12-01), Newsam
patent: 4150421 (1979-04-01), Nishihara et al.
patent: 4254445 (1981-03-01), Ho
patent: 4302625 (1981-11-01), Hetherington et al.
patent: 4371744 (1983-02-01), Badet et al.
S. Picard, Printed-Circuit Card Rework Process, IBM Tech. Discl. Bull., vol. 15, No. 1, Jun. 1972, pp. 246 & 247.

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