4. Organic compounds -- part of the class 532-570 series
  5. Organic compounds
  6. Aluminum containing

Steven W. Johnston

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Alloyed underlayer for microelectronic interconnects

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Amine-free deposition of metal-nitride films

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Apparatus and method for measuring minority carrier...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Apparatus for recharging a heated receptacle with particulate ma

Dispensing – With casing or support – Jacketed
Patent

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Atomic layer deposited tantalum containing adhesion layer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-414132

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