4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Die bond

Steven R. Codding

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Application of a thermally conductive thin film to a wafer...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Method of polishing C4 molybdenum masks to remove molybdenum...

Etching a substrate: processes – Forming or treating mask used for its nonetching function
Reexamination Certificate

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Method of thinning a semiconductor substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Method of thinning a semiconductor substrate

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate

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Method to recover patterned semiconductor wafers for rework

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Profile ID: LFUS-PAI-P-2282659

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