Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2011-01-11
2011-01-11
Chambliss, Alonzo (Department: 2892)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C438S459000
Reexamination Certificate
active
07867876
ABSTRACT:
A C4 grind tape and a laser-ablative adhesive layer are formed on a front side of a semiconductor substrate. A carrier substrate is thereafter attached to the laser-ablative adhesive layer. The back side of the semiconductor substrate is thinned by polishing or grinding, during which the carrier substrate provides mechanical support to enable thinning of the semiconductor substrate to a thickness of about 25 μm. A film frame tape is attached to the back side of the thinned semiconductor substrate and the laser-ablative adhesive layer is ablated by laser, thereby dissociating the carrier substrate from the back side of the C4 grind tape. The assembly of the film frame tape, the thinned semiconductor substrate, and the C4 grind tape is diced. The C4 grind tape is irradiated by ultraviolet light to become less adhesive, and is subsequently removed.
REFERENCES:
patent: 5258236 (1993-11-01), Arjavalingam et al.
patent: 6030485 (2000-02-01), Yamada
patent: 6689543 (2004-02-01), Kresge et al.
patent: 6905946 (2005-06-01), Grigg et al.
patent: 7105424 (2006-09-01), Tsai et al.
patent: 7141487 (2006-11-01), Periasamy et al.
patent: 7232740 (2007-06-01), Mountain
patent: 7235426 (2007-06-01), Tsai
patent: 2006/0189095 (2006-08-01), Ghyselen et al.
patent: 2008/0293217 (2008-11-01), Ghyselen et al.
Donelon et al. “Lift-Off Stencil Created by Laser Ablation”, IBM Technical Disclosure Bulletin.
Codding Steven R.
Krywanczyk Timothy C.
Neary Timothy E.
Sprogis Edmund J.
Chambliss Alonzo
International Business Machines - Corporation
Kotulak, Esq. Richard
Scully , Scott, Murphy & Presser, P.C.
LandOfFree
Method of thinning a semiconductor substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of thinning a semiconductor substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of thinning a semiconductor substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2711062