Application of a thermally conductive thin film to a wafer...

Details Application of a thermally conductive thin film to a wafer... Application of a thermally conductive thin film to a wafer...

2008-06-17

2008-06-17

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S110000, C438S113000, C438S458000, C257S620000, C257SE21596, C257SE21599

Reexamination Certificate

active

07387911

ABSTRACT:
A thermally conductive protective film or layer is applied to the backside surface of a semiconductor wafer prior to a subsequent dicing operation performed on the wafer to singulate the wafer into diced semiconductor chips, during which the thin thermally conductive film minimizes and prevents chipping and cracking damage to the wafer and diced chips. During subsequent electrical operation of a diced chip, the thin thermally conductive film functions as a thermal conductor to dissipate and conduct away to a heat sink any heat generated during operation of the chip.

REFERENCES:
patent: 6023094 (2000-02-01), Kao et al.
patent: 6709953 (2004-03-01), Vasquez et al.
patent: 6734532 (2004-05-01), Koduri et al.
patent: 6790709 (2004-09-01), Dias et al.
patent: 6812548 (2004-11-01), Dias et al.
patent: 6916688 (2005-07-01), Kelkar et al.
patent: 2002/0173077 (2002-11-01), Ho et al.
patent: 2003/0143818 (2003-07-01), Vasquez et al.

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